Experimental verification of signal integrity deterioration due to package-common-mode resonance

Author

Nishimoto, Taiki ; Asai, Rikiya ; Matsushima, Tohlu ; Hisakado, Takashi ; Wada, Osami

Author_Institution

Dept. of Electr. Eng., Kyoto Univ., Kyoto, Japan

fYear

2012

fDate

17-21 Sept. 2012

Firstpage

1

Lastpage

4

Abstract

When an LSI package is mounted on a PCB, parasitic couplings are unintentionally generated between them. Antiresonance of these couplings (package-common-mode resonance) can cause degradation of signal and power integrity. In this paper, the authors experimentally verified the package-common-mode resonance by comparing scattering parameters with variation of CMOS output jitter. In order to suppress increase of the jitter, resister-dumping method was tested as a countermeasure.

Keywords

CMOS integrated circuits; coupled circuits; electronics packaging; jitter; printed circuits; CMOS output jitter; LSI package; PCB; coupling antiresonance; jitter suppression; package-common-mode resonance; parasitic coupling; power integrity; resister-dumping method; signal integrity deterioration; CMOS integrated circuits; Capacitors; Inductance; Jitter; Parasitic capacitance; Resonant frequency; Scattering parameters;

fLanguage

English

Publisher

ieee

Conference_Titel

Electromagnetic Compatibility (EMC EUROPE), 2012 International Symposium on

Conference_Location

Rome

ISSN

2325-0356

Print_ISBN

978-1-4673-0718-5

Type

conf

DOI

10.1109/EMCEurope.2012.6396871

Filename

6396871