Thermal stress analyses of inductive proximity sensors under thermal cycling condition

Author

Sung Yi ; Pickup, K.

Author_Institution

Mech. & Mater. Eng. Dept., Portland State Univ., Portland, OR, USA

fYear

2012

fDate

25-27 Sept. 2012

Firstpage

1

Lastpage

6

Abstract

In the present study, thermally induced stresses in inductive proximity sensors are investigated using the finite element method. High residual stresses are developed in the inductive proximity sensor because of hygro-thermal mismatches among components during the operation. Its operating temperature is from - 40°C to 85°C. During thermal cycles, residual stresses inside the sensor are calculated based on global and local finite element analyses. Failure mechanisms and stress distributions in the sensor as well as the components are discussed in detail.

Keywords

failure analysis; finite element analysis; inductive sensors; internal stresses; thermal stresses; failure mechanisms; finite element method; hygro-thermal mismatches; inductive proximity sensors; residual stresses; stress distributions; temperature 40 degC to 85 degC; thermal cycles; thermal cycling condition; thermally induced stress analysis; Finite element methods; Loading; Stress; Temperature sensors; Transistors;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal Investigations of ICs and Systems (THERMINIC), 2012 18th International Workshop on

Conference_Location

Budapest

Print_ISBN

978-1-4673-1882-2

Type

conf

Filename

6400630