• DocumentCode
    586907
  • Title

    On the choice of cascade de-embedding methods for on-wafer S-parameter measurement

  • Author

    Amakawa, Shuhei ; Takano, Kyoya ; Katayama, Kengo ; Motoyoshi, Mizuki ; Yoshida, Takafumi ; Fujishima, Minoru

  • Author_Institution
    Hiroshima Univ., Higashi-Hiroshima, Japan
  • fYear
    2012
  • fDate
    21-23 Nov. 2012
  • Firstpage
    134
  • Lastpage
    136
  • Abstract
    Performance of thru-only cascade de-embedding methods and their variants that use a Π- or a T-equivalent to represent and bisect a symmetric THRU is assessed. The results from the Π- and T-based methods are reasonable at low frequencies. However they are shown to deviate noticeably from the correct results as the frequency gets high or, equivalently, when the length of the THRU approaches an effective wavelength λ. A better alternative at high frequencies is TSD (thru-short-delay), which, when THRU is symmetric, requires only THRU and LINE. TSD gives correct results except in the periodically appearing `dead zones´, provided that the characteristic impedance, Zχ, of the transmission line (TL) in the LINE is known. A Π-based method could be used to extract Zχ at low frequencies, from which Zχ can be extrapolated to higher frequencies.
  • Keywords
    CMOS integrated circuits; S-parameters; UHF integrated circuits; delays; field effect MIMIC; field effect MMIC; transmission lines; Π-based methods; T-based methods; TSD; cascade de-embedding methods; characteristic impedance; frequency 1 GHz to 110 GHz; millimeter-wave CMOS circuit; on-wafer S-parameter measurement; symmetric THRU approach; thru-short-delay; transmission line; Impedance; Power transmission lines; Radio frequency; Scattering parameters; Standards; Transmission line matrix methods; Transmission line measurements; S parameters; TSD; de-embedding; on-wafer measurement; renormalization transformation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Radio-Frequency Integration Technology (RFIT), 2012 IEEE International Symposium on
  • Conference_Location
    Singapore
  • Print_ISBN
    978-1-4673-2303-1
  • Type

    conf

  • DOI
    10.1109/RFIT.2012.6401638
  • Filename
    6401638