Title :
28nm FDSOI offer for academia and industry
Author_Institution :
CMP, Grenoble, France
Abstract :
The presentations of slides covers the following topics: CMP process; FDSOI; design kits; and standard cells library.
Keywords :
chemical mechanical polishing; integrated circuit design; silicon-on-insulator; CMP process; FDSOI; design kits; size 28 nm; standard cells library; Conferences; Educational institutions; Industries; Joining processes; Libraries; Prototypes;
Conference_Titel :
SOI Conference (SOI), 2012 IEEE International
Conference_Location :
NAPA, CA
Print_ISBN :
978-1-4673-2690-2
Electronic_ISBN :
1078-621X
DOI :
10.1109/SOI.2012.6404351