DocumentCode
588148
Title
Total-ionizing-dose radiation response of 32 nm partially and 45 nm fully-depleted SOI devices
Author
Rezzak, Nadia ; Zhang, E.X. ; Ball, D.R. ; Alles, Michael L. ; Loveless, T.D. ; Schrimpf, R.D. ; Rodbell, Kenneth P.
Author_Institution
Vanderbilt Univ., Nashville, TN, USA
fYear
2012
fDate
1-4 Oct. 2012
Firstpage
1
Lastpage
2
Abstract
TID-induced changes in 32 nm PD SOI devices depend on the device variant: low VT devices show minor increased in leakage, high VT devices show negligible change. Simulated sensitivity of TID to the gate work function of the high-k metal gate and associated doping changes confirm that the body doping remains high and generally mitigates TID sensitivity. Preliminary ring oscillator measurements show no measurable change in supply current or frequency with TID. Specially designed experimental 45 nm SOI FDSOI devices exhibit a pronounced TID-induced VT shift due to the coupling with the BOX layer.
Keywords
MOSFET; high-k dielectric thin films; radiation hardening (electronics); silicon-on-insulator; work function; BOX layer; NMOS; SOI FDSOI devices; TID simulated sensitivity; TID-induced voltage shift; body doping; fully-depleted SOI devices; gate work function; high-k metal gate; partially-depleted SOI devices; ring oscillator measurements; size 32 nm; size 45 nm; total-ionizing-dose radiation response; Current measurement; Doping profiles; Logic gates; Metals; Semiconductor process modeling; Sensitivity;
fLanguage
English
Publisher
ieee
Conference_Titel
SOI Conference (SOI), 2012 IEEE International
Conference_Location
NAPA, CA
ISSN
1078-621X
Print_ISBN
978-1-4673-2690-2
Electronic_ISBN
1078-621X
Type
conf
DOI
10.1109/SOI.2012.6404374
Filename
6404374
Link To Document