• DocumentCode
    588148
  • Title

    Total-ionizing-dose radiation response of 32 nm partially and 45 nm fully-depleted SOI devices

  • Author

    Rezzak, Nadia ; Zhang, E.X. ; Ball, D.R. ; Alles, Michael L. ; Loveless, T.D. ; Schrimpf, R.D. ; Rodbell, Kenneth P.

  • Author_Institution
    Vanderbilt Univ., Nashville, TN, USA
  • fYear
    2012
  • fDate
    1-4 Oct. 2012
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    TID-induced changes in 32 nm PD SOI devices depend on the device variant: low VT devices show minor increased in leakage, high VT devices show negligible change. Simulated sensitivity of TID to the gate work function of the high-k metal gate and associated doping changes confirm that the body doping remains high and generally mitigates TID sensitivity. Preliminary ring oscillator measurements show no measurable change in supply current or frequency with TID. Specially designed experimental 45 nm SOI FDSOI devices exhibit a pronounced TID-induced VT shift due to the coupling with the BOX layer.
  • Keywords
    MOSFET; high-k dielectric thin films; radiation hardening (electronics); silicon-on-insulator; work function; BOX layer; NMOS; SOI FDSOI devices; TID simulated sensitivity; TID-induced voltage shift; body doping; fully-depleted SOI devices; gate work function; high-k metal gate; partially-depleted SOI devices; ring oscillator measurements; size 32 nm; size 45 nm; total-ionizing-dose radiation response; Current measurement; Doping profiles; Logic gates; Metals; Semiconductor process modeling; Sensitivity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    SOI Conference (SOI), 2012 IEEE International
  • Conference_Location
    NAPA, CA
  • ISSN
    1078-621X
  • Print_ISBN
    978-1-4673-2690-2
  • Electronic_ISBN
    1078-621X
  • Type

    conf

  • DOI
    10.1109/SOI.2012.6404374
  • Filename
    6404374