• DocumentCode
    589379
  • Title

    Impact of fin thickness and height on read stability / write ability in tri-gate FinFET based SRAM

  • Author

    Junha Lee ; Hanwool Jeong ; Younghwi Yang ; Jisu Kim ; Seong-Ook Jung

  • Author_Institution
    Sch. of Electr. & Electron. Eng., Yonsei Univ., Seoul, South Korea
  • fYear
    2012
  • fDate
    4-7 Nov. 2012
  • Firstpage
    479
  • Lastpage
    482
  • Abstract
    In this paper, we research on fin thickness (Tfin) and fin height (Hfin) effects on read stability and write ability of tri-gate FinFET based SRAM cell. The degree of drain induced barrier lowering changes with Tfin and fin Hfin. This makes threshold voltage (Vth) vary. Thus, Tfin and Hfin also influence the mean and standard deviation of read static noise margin (RSNM) and word-line write trip voltage (WWTV) since Vth variation is a dominant factor determining them. If Tfin increases, the mean of RSNM (μRSNM) and the mean of WWTV (μWWTV) decreases and increases, respectively, while the standard deviation of RSNM (σRSNM) and WWTV (σWWTV) are almost not changed. If Hfin increases, the μRSNM and μWWTV decreases and increases, respectively, while both σRSNM and σWWTV decrease. However, for a sufficiently small Tfin, the effect of Hfin on μRSNM and μWWTV becomes negligible.
  • Keywords
    MOSFET; SRAM chips; statistical analysis; RSNM; WWTV; drain induced barrier; fin height; fin thickness; mean deviation; read stability; read static noise margin; standard deviation; threshold voltage; tri-gate FinFET based SRAM cell; word-line write trip voltage; write ability; Arrays; FinFETs; Logic gates; Stability analysis; Fin height; Fin thickness; FinFET; SRAM; Stabillity; Tri-gate;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    SoC Design Conference (ISOCC), 2012 International
  • Conference_Location
    Jeju Island
  • Print_ISBN
    978-1-4673-2989-7
  • Electronic_ISBN
    978-1-4673-2988-0
  • Type

    conf

  • DOI
    10.1109/ISOCC.2012.6406900
  • Filename
    6406900