DocumentCode
589379
Title
Impact of fin thickness and height on read stability / write ability in tri-gate FinFET based SRAM
Author
Junha Lee ; Hanwool Jeong ; Younghwi Yang ; Jisu Kim ; Seong-Ook Jung
Author_Institution
Sch. of Electr. & Electron. Eng., Yonsei Univ., Seoul, South Korea
fYear
2012
fDate
4-7 Nov. 2012
Firstpage
479
Lastpage
482
Abstract
In this paper, we research on fin thickness (Tfin) and fin height (Hfin) effects on read stability and write ability of tri-gate FinFET based SRAM cell. The degree of drain induced barrier lowering changes with Tfin and fin Hfin. This makes threshold voltage (Vth) vary. Thus, Tfin and Hfin also influence the mean and standard deviation of read static noise margin (RSNM) and word-line write trip voltage (WWTV) since Vth variation is a dominant factor determining them. If Tfin increases, the mean of RSNM (μRSNM) and the mean of WWTV (μWWTV) decreases and increases, respectively, while the standard deviation of RSNM (σRSNM) and WWTV (σWWTV) are almost not changed. If Hfin increases, the μRSNM and μWWTV decreases and increases, respectively, while both σRSNM and σWWTV decrease. However, for a sufficiently small Tfin, the effect of Hfin on μRSNM and μWWTV becomes negligible.
Keywords
MOSFET; SRAM chips; statistical analysis; RSNM; WWTV; drain induced barrier; fin height; fin thickness; mean deviation; read stability; read static noise margin; standard deviation; threshold voltage; tri-gate FinFET based SRAM cell; word-line write trip voltage; write ability; Arrays; FinFETs; Logic gates; Stability analysis; Fin height; Fin thickness; FinFET; SRAM; Stabillity; Tri-gate;
fLanguage
English
Publisher
ieee
Conference_Titel
SoC Design Conference (ISOCC), 2012 International
Conference_Location
Jeju Island
Print_ISBN
978-1-4673-2989-7
Electronic_ISBN
978-1-4673-2988-0
Type
conf
DOI
10.1109/ISOCC.2012.6406900
Filename
6406900
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