• DocumentCode
    59012
  • Title

    A 3D-HARPSS Polysilicon Microhemispherical Shell Resonating Gyroscope: Design, Fabrication, and Characterization

  • Author

    Peng Shao ; Tavassoli, Vahid ; Mayberry, Curtis L. ; Ayazi, Farrokh

  • Author_Institution
    Woodruff Sch. of Mech. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
  • Volume
    15
  • Issue
    9
  • fYear
    2015
  • fDate
    Sept. 2015
  • Firstpage
    4974
  • Lastpage
    4985
  • Abstract
    This paper presents, for the first time, the analysis, design, fabrication, and characterization of a microhemispherical resonating gyroscope (μ HRG). A 3D high aspect-ratio poly- and single-crystalline silicon (HARPSS) process is developed to fabricate a stem-supported hemispherical shell with self-aligned tall capacitive electrodes intended for driving, sensing, and tuning of the gyroscope. The monolithic process consists of seven lithographic steps combining the HARPSS process with fabrication of a 3D curved microstructure to create electrodes with scalable capacitive gaps. The fabrication is successfully demonstrated with polysilicon μ HRG prototypes with a diameter of 1.2 mm and a shell thickness of 1 μm. The frequency response is measured and gyro operation is examined using the integrated electrodes. Mode matching and mode alignment are successfully performed by applying tuning and quadrature nulling voltages. A closed-loop rate sensitivity scale factor of 8.57 mV/°/s was measured. Furthermore, design and process optimization of the support structure resulted in an improved quality factor (Q ~ 40 000).
  • Keywords
    capacitance measurement; capacitive sensors; electrochemical electrodes; elemental semiconductors; frequency measurement; gyroscopes; lithography; microcavities; microelectrodes; microfabrication; micromechanical resonators; microsensors; silicon; 3D curved microstructure; 3D high aspect-ratio polysingle-crystalline silicon process; 3D-HARPSS polysilicon microhemispherical shell resonating gyroscope; Si; closed-loop rate sensitivity; frequency measurement; integrated electrode; lithographic; microfabrication; mode alignment; mode matching; monolithic process; optimization; polysilicon μHRG prototype; quadrature nulling voltage; self-aligned tall capacitive electrode; size 1 mum; size 1.2 mm; stem-supported hemispherical shell; Damping; Electrodes; Fabrication; Gyroscopes; Noise; Resonant frequency; Sensors; MEMS gyroscopes; fabrication; frequency split; quality factor;
  • fLanguage
    English
  • Journal_Title
    Sensors Journal, IEEE
  • Publisher
    ieee
  • ISSN
    1530-437X
  • Type

    jour

  • DOI
    10.1109/JSEN.2015.2431857
  • Filename
    7105361