DocumentCode
59062
Title
Pulse Thermal Processing for Low Thermal Budget Integration of IGZO Thin Film Transistors
Author
Joo Hyon Noh ; Joshi, Pooran C. ; Kuruganti, Teja ; Rack, Philip D.
Author_Institution
Dept. of Mater. Sci. & Eng., Univ. of Tennessee, Knoxville, TN, USA
Volume
3
Issue
3
fYear
2015
fDate
May-15
Firstpage
297
Lastpage
301
Abstract
Pulse thermal processing (PTP) has been explored for low thermal budget integration of indium gallium zinc oxide (IGZO) thin film transistors (TFTs). The IGZO TFTs are exposed to a broadband (0.2-1.4 μm) arc lamp radiation spectrum with 100 pulses of 1 m pulse width. With power density of 3.95 kW/cm2 and 0.1 s total irradiation time, the PTP treated IGZO TFTs showed comparable or improved switching and bias stability properties, at significantly lower thermal budget, to furnace annealed IGZO TFT. The typical field effect mobility μFE, threshold voltage VT, and sub-threshold gate swing S.S were calculated to be 7.8 cm2/V·s, 8.1 V, and 0.22 V/decade, respectively. The observed performance shows promise for low thermal budget TFT integration on flexible substrates exploiting the large-area, scalable PTP technology.
Keywords
annealing; arc lamps; gallium compounds; indium compounds; thermal analysis; thin film transistors; zinc compounds; IGZO TFT annealing; IGZO thin film transistors; InGaZnO; arc lamp radiation spectrum; bias stability property improvement; field effect mobility; flexible substrates; low thermal budget integration; power density; pulse thermal processing; scalable PTP technology; subthreshold gate swing; switching improvement; threshold voltage VT; time 0.1 s; total irradiation time; voltage 8.1 V; Annealing; Furnaces; Plasma temperature; Polymers; Substrates; Temperature; Thin film transistors; Thin film transistors; pulse thermal annealing; thin film;
fLanguage
English
Journal_Title
Electron Devices Society, IEEE Journal of the
Publisher
ieee
ISSN
2168-6734
Type
jour
DOI
10.1109/JEDS.2014.2376411
Filename
6967717
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