• DocumentCode
    59062
  • Title

    Pulse Thermal Processing for Low Thermal Budget Integration of IGZO Thin Film Transistors

  • Author

    Joo Hyon Noh ; Joshi, Pooran C. ; Kuruganti, Teja ; Rack, Philip D.

  • Author_Institution
    Dept. of Mater. Sci. & Eng., Univ. of Tennessee, Knoxville, TN, USA
  • Volume
    3
  • Issue
    3
  • fYear
    2015
  • fDate
    May-15
  • Firstpage
    297
  • Lastpage
    301
  • Abstract
    Pulse thermal processing (PTP) has been explored for low thermal budget integration of indium gallium zinc oxide (IGZO) thin film transistors (TFTs). The IGZO TFTs are exposed to a broadband (0.2-1.4 μm) arc lamp radiation spectrum with 100 pulses of 1 m pulse width. With power density of 3.95 kW/cm2 and 0.1 s total irradiation time, the PTP treated IGZO TFTs showed comparable or improved switching and bias stability properties, at significantly lower thermal budget, to furnace annealed IGZO TFT. The typical field effect mobility μFE, threshold voltage VT, and sub-threshold gate swing S.S were calculated to be 7.8 cm2/V·s, 8.1 V, and 0.22 V/decade, respectively. The observed performance shows promise for low thermal budget TFT integration on flexible substrates exploiting the large-area, scalable PTP technology.
  • Keywords
    annealing; arc lamps; gallium compounds; indium compounds; thermal analysis; thin film transistors; zinc compounds; IGZO TFT annealing; IGZO thin film transistors; InGaZnO; arc lamp radiation spectrum; bias stability property improvement; field effect mobility; flexible substrates; low thermal budget integration; power density; pulse thermal processing; scalable PTP technology; subthreshold gate swing; switching improvement; threshold voltage VT; time 0.1 s; total irradiation time; voltage 8.1 V; Annealing; Furnaces; Plasma temperature; Polymers; Substrates; Temperature; Thin film transistors; Thin film transistors; pulse thermal annealing; thin film;
  • fLanguage
    English
  • Journal_Title
    Electron Devices Society, IEEE Journal of the
  • Publisher
    ieee
  • ISSN
    2168-6734
  • Type

    jour

  • DOI
    10.1109/JEDS.2014.2376411
  • Filename
    6967717