DocumentCode :
594250
Title :
Vertical interconnect modeling between GCPWs in LTCC technology
Author :
Pavan, C.L.N. ; Raju, K. C. James
Author_Institution :
Sch. of Phys., Univ. of Hyderabad, Hyderabad, India
fYear :
2012
fDate :
5-7 Dec. 2012
Firstpage :
211
Lastpage :
213
Abstract :
In this paper, vertical via interconnects between Grounded Coplanar Waveguide (GCPW) transmission lines in Low Temperature Cofired Ceramic (LTCC) Technology has been simulated for realization at C-MET, Pune. The S-parameters of the overall structure have been computed. A parametric study has been performed by varying via parameters like via diameter, via height and the resulting performance has been analyzed. An equivalent lumped element model for vias has been shown and the corresponding model parameters are extracted. The insertion loss is observed to be better than 0.4 dB and return loss is below -14 dB up to 10 GHz frequency.
Keywords :
S-parameters; coplanar waveguides; interconnections; transmission lines; GCPW transmission lines; LTCC technology; S-parameters; equivalent lumped element model; grounded coplanar waveguide; insertion loss; low temperature cofired ceramic technology; vertical interconnect modeling; Computational modeling; Conductors; Coplanar waveguides; Educational institutions; Integrated circuit interconnections; Microwave circuits; Substrates; GCPW; LTCC; Vertical Interconnects and 3D-IC;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microelectronics and Electronics (PrimeAsia), 2012 Asia Pacific Conference on Postgraduate Research in
Conference_Location :
Hyderabad
ISSN :
2159-2144
Print_ISBN :
978-1-4673-5065-5
Type :
conf
DOI :
10.1109/PrimeAsia.2012.6458656
Filename :
6458656
Link To Document :
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