• DocumentCode
    598287
  • Title

    Reliability of inversion channel InGaAs n-MOSFETs

  • Author

    Ming-Fu Li ; Guangfan Jiao ; Yi Xuan ; Daming Huang ; Ye, Peide D.

  • Author_Institution
    Dept. Microelectron., Fudan Univ., Shanghai, China
  • fYear
    2012
  • fDate
    Oct. 29 2012-Nov. 1 2012
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Reliability of InGaAs inversion channel n-MOSFET is investigated by systematic PBTI (positive bias temperature instability) stresses. The very complicated degradation phenomena are totally different from Si based MOSFETs. The degradation is mainly contributed by the generation of border traps under stress with recoverable donor trap of energy density ΔDSOXDONOR in the InGaAs energy gap with a tail extending to the conduction band energy, and with permanent acceptor trap of energy density ΔDSOXACCEPTOR in the conduction band energy with a tail extending to the energy gap. The border trap model can explain all the experimental details of the PBTI degradation phenomena.
  • Keywords
    III-V semiconductors; MOSFET; electron traps; energy gap; gallium arsenide; indium compounds; semiconductor device reliability; InGaAs; PBTI degradation phenomena; border trap; conduction band energy; donor trap; energy density; energy gap; inversion channel n-MOSFET; permanent acceptor trap; positive bias temperature instability stress; reliability; systematic PBTI; Degradation; Dielectric measurements; Educational institutions; Indium gallium arsenide; Logic gates; MOSFET circuits; Stress;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State and Integrated Circuit Technology (ICSICT), 2012 IEEE 11th International Conference on
  • Conference_Location
    Xi´an
  • Print_ISBN
    978-1-4673-2474-8
  • Type

    conf

  • DOI
    10.1109/ICSICT.2012.6467593
  • Filename
    6467593