DocumentCode
598287
Title
Reliability of inversion channel InGaAs n-MOSFETs
Author
Ming-Fu Li ; Guangfan Jiao ; Yi Xuan ; Daming Huang ; Ye, Peide D.
Author_Institution
Dept. Microelectron., Fudan Univ., Shanghai, China
fYear
2012
fDate
Oct. 29 2012-Nov. 1 2012
Firstpage
1
Lastpage
4
Abstract
Reliability of InGaAs inversion channel n-MOSFET is investigated by systematic PBTI (positive bias temperature instability) stresses. The very complicated degradation phenomena are totally different from Si based MOSFETs. The degradation is mainly contributed by the generation of border traps under stress with recoverable donor trap of energy density ΔDSOXDONOR in the InGaAs energy gap with a tail extending to the conduction band energy, and with permanent acceptor trap of energy density ΔDSOXACCEPTOR in the conduction band energy with a tail extending to the energy gap. The border trap model can explain all the experimental details of the PBTI degradation phenomena.
Keywords
III-V semiconductors; MOSFET; electron traps; energy gap; gallium arsenide; indium compounds; semiconductor device reliability; InGaAs; PBTI degradation phenomena; border trap; conduction band energy; donor trap; energy density; energy gap; inversion channel n-MOSFET; permanent acceptor trap; positive bias temperature instability stress; reliability; systematic PBTI; Degradation; Dielectric measurements; Educational institutions; Indium gallium arsenide; Logic gates; MOSFET circuits; Stress;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State and Integrated Circuit Technology (ICSICT), 2012 IEEE 11th International Conference on
Conference_Location
Xi´an
Print_ISBN
978-1-4673-2474-8
Type
conf
DOI
10.1109/ICSICT.2012.6467593
Filename
6467593
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