A 60GHz microstrip antenna array based on PCB/Polypropylene composite substrate

Author

Bin Lu ; Jun Luo ; Li Zhang ; Yan Wang ; Ruifeng Yue

Author_Institution

Inst. of Microelectron., Tsinghua Univ., Beijing, China

fYear

2012

fDate

Oct. 29 2012-Nov. 1 2012

Firstpage

1

Lastpage

3

Abstract

We present a novel substrate material with good RF performances and low cost for the fabrication of millimeter-wave microstrip antennas. The substrate takes the copper layer of a FR-4 PCB board as its ground plane, and an Epoxy/Polypropylene/Epoxy composite layer is used as the dielectric material of the microstrip antenna. A 4×4 patch antenna array for 60GHz WPAN has been designed and fabricated on the substrate for demonstration, and the results of simulation and preliminary measurement are provided as well.

Keywords

copper; dielectric materials; microstrip antenna arrays; millimetre wave antenna arrays; personal area networks; printed circuits; Cu; FR-4 PCB board; PCB/polypropylene composite substrate; RF performances; WPAN; copper layer; dielectric material; epoxy/polypropylene/epoxy composite layer; frequency 60 GHz; ground plane; microstrip antenna array; millimeter-wave microstrip antennas; patch antenna array; substrate material; Antenna arrays; Antenna measurements; Arrays; Microstrip antennas; Substrates;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid-State and Integrated Circuit Technology (ICSICT), 2012 IEEE 11th International Conference on

Conference_Location

Xi´an

Print_ISBN

978-1-4673-2474-8

Type

conf

DOI

10.1109/ICSICT.2012.6467914

Filename

6467914