DocumentCode
598464
Title
Advanced ion implantation applications for leading edge transistor design
Author
Gossmann, H.L. ; Erokhin, Y.
Author_Institution
Appl. Mater. - Varian Semicond. Equip., Gloucester, MA, USA
fYear
2012
fDate
Oct. 29 2012-Nov. 1 2012
Firstpage
1
Lastpage
4
Abstract
Ion implantation is crucial to successful integration of integrated circuit process flows and has been so for more than 30 years, typically used in steps such as Well and Source/Drain formation. However, beyond those "classical" applications, ion implantation offers a wealth of opportunity directly in transistor design optimization, enabling improvements in defect control, device performance, and device yield. Here we discuss illustrating examples such as low-temperature implantation in Logic and Memory devices, line-edge roughness reduction, and series resistance reduction by work-function control through use of non-traditional implant-species. In IC manufacturing the change from furnace diffusion-based doping process to ion implantation greatly accelerated the growth of the IC industry to the size as we know it today. Similar expectations can arguably be made for Photovoltaics. We will discuss cell efficiency improvements demonstrated and potentially reachable if solar cell junctions are formed by ion implantation rather than furnace diffusion as well as the realizable cost reductions through elimination of process steps.
Keywords
integrated circuit yield; integrated memory circuits; ion implantation; logic devices; optimisation; transistors; work function; defect control; device performance; device yield; furnace diffusion-based doping process; integrated circuit manufacturing; integrated circuit process flows; ion implantation; leading edge transistor design; line-edge roughness reduction; logic devices; low-temperature implantation; memory devices; nontraditional implant-species; photovoltaics; series resistance reduction; source/drain formation; transistor design optimization; well formation; work-function control; Computer architecture; Cryogenics; Implants; Ion implantation; Junctions; Microprocessors; Silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State and Integrated Circuit Technology (ICSICT), 2012 IEEE 11th International Conference on
Conference_Location
Xi´an
Print_ISBN
978-1-4673-2474-8
Type
conf
DOI
10.1109/ICSICT.2012.6467958
Filename
6467958
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