Title :
(Invited) Challenges in Engineering RRAM technology for high density applications
Author :
Ramaswamy, Nirmal
Author_Institution :
Emerging Memory Group, Micron Technology
Abstract :
Summary form only given. Although RRAM technology shows significant potential to be a major component of future memory systems, significant challenges exist for high density RRAM applications. Some of these critical challenges such as read noise, retention, endurance and tail bit performance will be discussed.
Conference_Titel :
Integrated Reliability Workshop Final Report (IRW), 2012 IEEE International
Conference_Location :
South Lake Tahoe, CA
Print_ISBN :
978-1-4673-2749-7
DOI :
10.1109/IIRW.2012.6468902
