Title :
Oxide trap annealing by H2 cracking at E´ center under NBTI stress
Author :
Tahanout, Cherifa ; Nadji, B. ; Tahi, Hakim ; Djezzar, Boualem ; Benabdelmoumene, Abdelmadjid ; Chenouf, Amel
Author_Institution :
Dept. of Autom. & Electrification of the Ind. Processes, Univ. M´hamed Bougara of Boumerdes, Boumerdes, Algeria
Abstract :
In this paper, we have modeled the results of negative bias temperature instability (NBTI) degradation obtained by using charge pumping and linear drain current techniques in the same time measurement setup. The proposed model is based on Hydrogen molecule (H2) cracking at trapped hole center (E´ center) to explain the decrease of oxide trapped charge at long NBTI stress time (t > 1000s). In fact, according to experimental data, which are obtained in the framework of the above cited setup, NBTI induces oxide trap generation at earlier stress time followed later by a decrease (annealing) at long stress time. This behavior looks like annealing in radiation effect on gate oxide in MOSFET, which is explained by H2 cracking model. Based on this similarity, we extended this model to NBTI effect. The extended model presents a perfect correlation with the experimental data.
Keywords :
MOSFET; annealing; hole traps; hydrogen; negative bias temperature instability; semiconductor device models; semiconductor device reliability; E´ center; H2; H2 cracking model; MOSFET; NBTI stress; charge pumping; linear drain current technique; negative bias temperature instability; oxide trap annealing; oxide trap generation; radiation effect; trapped hole center; Charge carrier processes; Current measurement; Hydrogen; Logic gates; Silicon; Stress; Temperature measurement; H2 cracking; Hole trapping; NBTI; Positive oxide-trap;
Conference_Titel :
Microelectronics (ICM), 2012 24th International Conference on
Conference_Location :
Algiers
Print_ISBN :
978-1-4673-5289-5
DOI :
10.1109/ICM.2012.6471425