• DocumentCode
    599573
  • Title

    Safe operating area of a 0.15µm GaAs PHEMT in overdrive operating conditions

  • Author

    Ismail, Nur ; Kalboussi, A.

  • Author_Institution
    Lab. of Microelectron. & Instrum., Univ. of Monastir, Monastir, Tunisia
  • fYear
    2012
  • fDate
    16-20 Dec. 2012
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    We present an evaluation of the safe operating area of a 0.15 μm GaAs PHEMT operating under overdrive conditions. The approach, used to delimit the device safe operating area, consists on performing on-state and off-state accelerated DC step stresses for bias conditions included in the device breakdown region. The accelerated DC stresses have induced weak degradations of the device electrical parameters attributed to trap effects.
  • Keywords
    III-V semiconductors; gallium arsenide; high electron mobility transistors; semiconductor device breakdown; DC step stresses; PHEMT; accelerated DC stresses; device breakdown region; device electrical parameters; high electron mobility transistors; overdrive operating conditions; safe operating area; size 0.15 mum; trap effects; Current measurement; Degradation; Electric breakdown; Logic gates; PHEMTs; Performance evaluation; Stress; FETs; breakdown voltage; gallium arsenide; reliability;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microelectronics (ICM), 2012 24th International Conference on
  • Conference_Location
    Algiers
  • Print_ISBN
    978-1-4673-5289-5
  • Type

    conf

  • DOI
    10.1109/ICM.2012.6471437
  • Filename
    6471437