• DocumentCode
    600293
  • Title

    The impact of process maturity on defect density

  • Author

    Shah, Syed Muhammad Ali ; Morisio, Maurizio ; Torchiano, Marco

  • Author_Institution
    Politec. di Torino, Turin, Italy
  • fYear
    2012
  • fDate
    20-21 Sept. 2012
  • Firstpage
    315
  • Lastpage
    318
  • Abstract
    Context: A common assumption in software engineering is that a more structured process delivers higher quality products. However, there are limited empirical studies that support this assumption. Objective: In this paper we analyze 61 projects looking for a relationship between process structured and quality of the product. The structure is considered under two dimensions: level of maturity (as measured by the CMMI assessment model) and type (e.g. TSP, RUP). The quality of the product is measured in terms of Defect Density (DD) defined as the number of delivered defects divided per size. Results: We found a small and statistically not significant difference of DD between the projects developed under CMMI and those that are not developed under CMMI. Considering the CMMI levels, the pair (CMMI 1, CMMI 3) is characterized by a statistically significant different DD. CMMI 1 exhibiting higher DD than CMMI 3. By comparing different software processes with each other we found that Hybrid process exhibits statistically significant lower DD than Waterfall. Conclusion: Software process in either dimension, level of maturity and type has an impact on the software quality but smaller than one might expect.
  • Keywords
    Capability Maturity Model; software quality; CMMI assessment model; capability maturity model integration; defect density; maturity level; process maturity; process structure; product quality; software engineering; software process; software quality; Companies; Measurement; Software engineering; Software quality; Software reliability; Defect density; Software process; Software quality;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Empirical Software Engineering and Measurement (ESEM), 2012 ACM-IEEE International Symposium on
  • Conference_Location
    Lund
  • ISSN
    1938-6451
  • Print_ISBN
    978-1-4503-1056-7
  • Electronic_ISBN
    1938-6451
  • Type

    conf

  • DOI
    10.1145/2372251.2372308
  • Filename
    6475433