• DocumentCode
    601116
  • Title

    Recognition of obstacle distribution via vibrotactile stimulation for the visually disabled

  • Author

    Kee-Ho Yu ; Myoung-Jong Yoon ; Gu-Young Jeong

  • Author_Institution
    Dept. of Aerosp. Eng., Chonbuk Nat. Univ., Jeonju, South Korea
  • fYear
    2013
  • fDate
    Feb. 27 2013-March 1 2013
  • Firstpage
    564
  • Lastpage
    569
  • Abstract
    A tactile display is able to help the walking support system of a visually disabled person. A walking guide system must detect an obstacle´s distribution in walking space including hanging and/or protruding obstacles, and provide useful feedback for safe walking. In this study, we investigate the applicability of a tactile display to the walking guide. The obstacle information is transmitted to the palm by tactile stimulation. The three dimensional (3D) detection of an obstacle´s distribution using ultrasonic sensors, the fabrication of a tactile stimulator using vibration motors, and the mapping of the detected results to an array-type tactile stimulator are proposed. An experiment on the recognition of an obstacle´s distribution via tactile stimulation is performed to evaluate the possibility of a walking guide. In the experimental result, the average recognition rate was 95.14 % (5.73, standard error).
  • Keywords
    gait analysis; handicapped aids; haptic interfaces; object recognition; sensor arrays; tactile sensors; array-type tactile stimulator fabrication; average recognition rate; hanging obstacles; obstacle distribution recognition; protruding obstacles; tactile display; three-dimensional obstacle distribution detection; ultrasonic sensors; vibration motors; vibrotactile stimulation; visually disabled person; walking guide; walking space; walking support system safety; Acoustics; Legged locomotion; Sensor arrays; Tactile sensors; Three-dimensional displays; Vibrations; Component; formatting; insert; style; styling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Mechatronics (ICM), 2013 IEEE International Conference on
  • Conference_Location
    Vicenza
  • Print_ISBN
    978-1-4673-1386-5
  • Electronic_ISBN
    978-1-4673-1387-2
  • Type

    conf

  • DOI
    10.1109/ICMECH.2013.6519104
  • Filename
    6519104