DocumentCode
601582
Title
Design of DC-side wiring structure for high-speed switching operation using SiC power devices
Author
Wada, Keiji ; Ando, Masato ; Hino, Akihiro
Author_Institution
Department of Electrical and Electronics Engineering, Tokyo Metropolitan University, 1-1 Minami Oosawa, Hachioji, JAPAN
fYear
2013
fDate
17-21 March 2013
Firstpage
584
Lastpage
590
Abstract
In power electronics circuits, the stray inductance of a bus bar between a DC capacitor and power devices may affect an overvoltage and influence the switching losses under high-speed switching operation. Therefore, it is necessary to design the wiring structure by considering the stray inductance of the bus bar. An inductance map is proposed to clarify the relationship between wiring structure and stray inductance of a DC-side bus bar. The inductance map is drawn using a partial inductance calculation method. In addition, the design procedure of the wiring structure with consideration the stray inductance of the bus bar is shown using the inductance map. This paper makes four types of DC-side bus bars for a buck chopper circuit, and the over voltages under the turn-off switching are discussed by the experiments. The experimental results rated at 500 V, and 70 A for a buck chopper circuit using SiC-MOSFET and SiC-SBD confirm the validity of the design procedure.
Keywords
Bus bar; Inductance Map; Laminated Structure; Stray Inductance;
fLanguage
English
Publisher
ieee
Conference_Titel
Applied Power Electronics Conference and Exposition (APEC), 2013 Twenty-Eighth Annual IEEE
Conference_Location
Long Beach, CA, USA
ISSN
1048-2334
Print_ISBN
978-1-4673-4354-1
Electronic_ISBN
1048-2334
Type
conf
DOI
10.1109/APEC.2013.6520269
Filename
6520269
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