Title :
Double-sided cooling design for novel planar module
Author :
Ning, Puqi ; Liang, Zhenxian ; Wang, Fei
Author_Institution :
Energy and Environmental Sciences Directorate, Oak Ridge National Lab, Knoxville, TN, USA
Abstract :
A novel packaging structure for medium power modules featuring power semiconductor switches sandwiched between two symmetric substrates that fulfill electrical conduction and insulation functions is presented. Large bonding areas between dies and substrates allow this packaging technology to offer significant improvements in electrical, thermal performance. Double-sided cooling system was dedicatedly analyzed and designed for different applications.
Conference_Titel :
Applied Power Electronics Conference and Exposition (APEC), 2013 Twenty-Eighth Annual IEEE
Conference_Location :
Long Beach, CA, USA
Print_ISBN :
978-1-4673-4354-1
Electronic_ISBN :
1048-2334
DOI :
10.1109/APEC.2013.6520274
