Investigation of wetting behavior of Sn-3Ag-0.5Cu solder paste to BGA solder ball

Author

Yahya, Maryam Husna ; Nakamura, Keisuke ; Shohji, Ikuo ; Housen, Toshihiro ; Yamamoto, Yumi ; Kaga, Yoshio

Author_Institution

Department of Mechanical System Engineering, Gunma University, 1-5-1, Tenjin-cho, Kiryu, 376-8515, Japan

fYear

2012

fDate

6-8 Nov. 2012

Firstpage

1

Lastpage

5

Abstract

Wetting behavior of Sn-3Ag-0.5Cu (mass%) solder paste to BGA solder ball was investigated through the measurement of wetting force loaded onto the solder ball in reflow soldering process. The effect of the oxide film thickness on the solder ball, desorption of the solder ball from solder paste and timing of dipping for solder paste were investigated on wetting properties. Wetting properties were degraded by increasing the thickness of oxide film. Two steps in wetting behavior, which consists of wetting of flux and wetting of molten solder, were observed when the oxide film thickness is over approximately 6 nm. The increase of desorption time at temperature over the activated temperature of flux causes degradation in wetting properties. In the dipping temperature changing test, the effect of the oxide film thickness on wetting properties is negligible in the case of a few nm thick oxide film.

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Manufacturing Technology Symposium (IEMT), 2012 35th IEEE/CPMT International

Conference_Location

Ipoh, Perak, Malaysia

ISSN

1089-8190

Print_ISBN

978-1-4673-4384-8

Electronic_ISBN

1089-8190

Type

conf

DOI

10.1109/IEMT.2012.6521758

Filename

6521758