Improvement journey of strip test sticky issue

Quite number of material was affected with sticky issue in an excursion which contributed to 0.10% yield drop. This excursion was caused by the presence of a strong bond between the UV tape and the device which made the device inseparable for tape and reel process. The study involves analysis of the root cause of the bonding layer as well as the measures taken to deal with the affected material and improvement actions done to qualify a new UV tape which does not have sticky issue. An alternate process was qualified to clear the affected material after thorough quality analysis was made. The yield and DPPM comparison of the UV tapes are taken into consideration to gauge the performance of the new UV tape while saving realized through qualification of the alternate process for sticky devices were discussed.