• DocumentCode
    602597
  • Title

    Technology comparison for large last-level caches (L3Cs): Low-leakage SRAM, low write-energy STT-RAM, and refresh-optimized eDRAM

  • Author

    Mu-Tien Chang ; Rosenfeld, P. ; Shih-Lien Lu ; Jacob, Biji

  • fYear
    2013
  • fDate
    23-27 Feb. 2013
  • Firstpage
    143
  • Lastpage
    154
  • Abstract
    Large last-level caches (L3Cs) are frequently used to bridge the performance and power gap between processor and memory. Although traditional processors implement caches as SRAMs, technologies such as STT-RAM (MRAM), and eDRAM have been used and/or considered for the implementation of L3Cs. Each of these technologies has inherent weaknesses: SRAM is relatively low density and has high leakage current; STT-RAM has high write latency and write energy consumption; and eDRAM requires refresh operations. As future processors are expected to have larger last-level caches, the goal of this paper is to study the trade-offs associated with using each of these technologies to implement L3Cs. In order to make useful comparisons between SRAM, STTRAM, and eDRAM L3Cs, we model them in detail and apply low power techniques to each of these technologies to address their respective weaknesses. We optimize SRAM for low leakage and optimize STT-RAM for low write energy. Moreover, we classify eDRAM refresh-reduction schemes into two categories and demonstrate the effectiveness of using dead-line prediction to eliminate unnecessary refreshes. A comparison of these technologies through full-system simulation shows that the proposed refresh-reduction method makes eDRAM a viable, energy-efficient technology for implementing L3Cs.
  • Keywords
    DRAM chips; MRAM devices; SRAM chips; cache storage; energy consumption; low-power electronics; power aware computing; L3C; MRAM; dead-line prediction; eDRAM refresh-reduction schemes; energy-efficient technology; full-system simulation; large last-level caches; leakage current; low power techniques; low write-energy STT-RAM; low-leakage SRAM; refresh operations; refresh-optimized eDRAM; refresh-reduction method; technology comparison; write energy consumption; write latency; CMOS integrated circuits; CMOS technology; Capacitors; Magnetic tunneling; Radiation detectors; Random access memory; Transistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    High Performance Computer Architecture (HPCA2013), 2013 IEEE 19th International Symposium on
  • Conference_Location
    Shenzhen
  • ISSN
    1530-0897
  • Print_ISBN
    978-1-4673-5585-8
  • Type

    conf

  • DOI
    10.1109/HPCA.2013.6522314
  • Filename
    6522314