• DocumentCode
    602880
  • Title

    An arbitrary stressed NBTI compact model for analog/mixed-signal reliability simulations

  • Author

    Jinbo Wan ; Kerkhoff, Hans G.

  • Author_Institution
    Testable Design & Testing of Integrated Syst. Group, Univ. of Twente, Enschede, Netherlands
  • fYear
    2013
  • fDate
    4-6 March 2013
  • Firstpage
    31
  • Lastpage
    37
  • Abstract
    A compact NBTI model is presented by directly solving the reaction-diffusion (RD) equations in a simple way. The new model can handle arbitrary stress conditions without solving time-consuming equations and is hence very suitable for analog/mixed-signal NBTI simulations in SPICE-like environments. The model has been implemented in Cadence ADE with Verilog-A and also takes the stochastic effect of aging into account. The simulation speed has increased at least thousands times. The performance of the model is validated by both RD theoretical solutions as well as silicon results.
  • Keywords
    SPICE; hardware description languages; negative bias temperature instability; Cadence ADE; SPICE like environment; Verilog A; analog signal NBTI simulation; analog signal reliability simulation; arbitrary stress condition; mixed signal NBTI simulation; mixed signal reliability simulation; reaction diffusion equations; stressed NBTI compact model; time consuming equations; Aging; Degradation; Equations; Logic gates; Mathematical model; Silicon; Stress; NBTI; RD model; Reaction-Diffusion solution; Reliability; analog; mixed-signal; simulation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Quality Electronic Design (ISQED), 2013 14th International Symposium on
  • Conference_Location
    Santa Clara, CA
  • ISSN
    1948-3287
  • Print_ISBN
    978-1-4673-4951-2
  • Type

    conf

  • DOI
    10.1109/ISQED.2013.6523587
  • Filename
    6523587