DocumentCode
602880
Title
An arbitrary stressed NBTI compact model for analog/mixed-signal reliability simulations
Author
Jinbo Wan ; Kerkhoff, Hans G.
Author_Institution
Testable Design & Testing of Integrated Syst. Group, Univ. of Twente, Enschede, Netherlands
fYear
2013
fDate
4-6 March 2013
Firstpage
31
Lastpage
37
Abstract
A compact NBTI model is presented by directly solving the reaction-diffusion (RD) equations in a simple way. The new model can handle arbitrary stress conditions without solving time-consuming equations and is hence very suitable for analog/mixed-signal NBTI simulations in SPICE-like environments. The model has been implemented in Cadence ADE with Verilog-A and also takes the stochastic effect of aging into account. The simulation speed has increased at least thousands times. The performance of the model is validated by both RD theoretical solutions as well as silicon results.
Keywords
SPICE; hardware description languages; negative bias temperature instability; Cadence ADE; SPICE like environment; Verilog A; analog signal NBTI simulation; analog signal reliability simulation; arbitrary stress condition; mixed signal NBTI simulation; mixed signal reliability simulation; reaction diffusion equations; stressed NBTI compact model; time consuming equations; Aging; Degradation; Equations; Logic gates; Mathematical model; Silicon; Stress; NBTI; RD model; Reaction-Diffusion solution; Reliability; analog; mixed-signal; simulation;
fLanguage
English
Publisher
ieee
Conference_Titel
Quality Electronic Design (ISQED), 2013 14th International Symposium on
Conference_Location
Santa Clara, CA
ISSN
1948-3287
Print_ISBN
978-1-4673-4951-2
Type
conf
DOI
10.1109/ISQED.2013.6523587
Filename
6523587
Link To Document