DocumentCode
603744
Title
Semi empirical cadmium sulfide transistor model combining grain defects and semiconductor thickness variation
Author
Pasupuleti, N.S. ; Pieper, R. ; Wondmagegn, W. ; Coogan, A.L. ; Mejia, I. ; Salas-Villasenor, A. ; Quevedo-Lopez, M.
Author_Institution
Dept. of Electr. Eng., Univ. of Texas at Tyler, Tyler, TX, USA
fYear
2013
fDate
11-11 March 2013
Firstpage
6
Lastpage
11
Abstract
Proposed and tested is a methodology for modeling polycrystalline thin film transistors which exhibit shifts in threshold voltage due to both grain boundaries and semiconductor thickness. The process involves a model, which uses in part standard-analytic terms. It also includes terms for grain defects and for thickness added in using numerical simulation testing. From this testing, the threshold voltage for the CdS transistor exhibited an optimum thickness for enhancement mode operation. The semi empirical model was then brought into alignment with experimental results for a CdS transistor by adjusting the interface charge. Predictions from the semi empirical model produced transistor output characteristic and transfer curves showed to be in good agreement with experimental data.
Keywords
II-VI semiconductors; cadmium compounds; grain boundaries; numerical analysis; semiconductor device models; thin film transistors; wide band gap semiconductors; CdS; enhancement mode operation; grain boundaries; grain defects; interface charge; numerical simulation testing; polycrystalline thin film transistor modelling; semiconductor thickness variation; semiempirical cadmium sulfide transistor model; standard-analytic terms; threshold voltage shift; transfer curves; Data models; Numerical models; Semiconductor device modeling; Solid modeling; Thin film transistors; Threshold voltage; Electronics; Modeling and Simulation; semiconductor analysis;
fLanguage
English
Publisher
ieee
Conference_Titel
System Theory (SSST), 2013 45th Southeastern Symposium on
Conference_Location
Waco, TX
ISSN
0094-2898
Print_ISBN
978-1-4799-0037-4
Type
conf
DOI
10.1109/SSST.2013.6524957
Filename
6524957
Link To Document