DocumentCode
60453
Title
Analyzing UV/Vis/NIR and Photo-Acoustic Spectra: A Note to the Band Gap of
Author
Stadler, Alexander
Author_Institution
Univ. of Salzburg, Salzburg, Austria
Volume
26
Issue
1
fYear
2013
fDate
Feb. 2013
Firstpage
156
Lastpage
161
Abstract
Exact contact-free and non-destructive opto-electrical analysis of thin film and powder materials are necessary for efficient development and improvement of semiconductor devices. Besides the quality of the apparatus, the grade of the mathematical evaluation models is of importance for correct data acquisition. For UV/Vis/NIR spectroscopy, the single-layer model and the double-layer model, taking into account transmission and reflection spectra (with an integrating sphere), have shown excellent results, compared with other measurement techniques. A further comparatively unknown and contact-free optical analysis method is the photo-acoustic spectroscopy (PAS). In the following, it will be shown that both analyzing methods provide comparable band gap energies, using just the spectra or the well-known Tauc plot, respectively, an adequate novel plot for the PAS method. For verification, the band gap energy, Eg, of a silicon powder has been investigated. Then, direct and indirect Egs of special TixSi1-xO2 compounds, x=10%,..., 50% -prepared with a sophisticated sol-gel procedure-have been analyzed. The results point out that titanium is bound mainly in TiO2 (rutil), with increasing amounts of brookite and anatase in the case of rising x-values. For Ti contents below 10%, the powder tends, reasonably, to behave like a glass substrate.
Keywords
glass; infrared spectroscopy; optoelectronic devices; photoacoustic spectra; photonic band gap; powders; reflectivity; semiconductor thin films; silicon compounds; sol-gel processing; titanium compounds; ultraviolet spectroscopy; PAS method; Tauc plot; TixSi1-xO2; UV/Vis/NIR spectroscopy; apparatus quality; band gap energy; contact-free opto-electrical analysis; double-layer model; glass substrate; mathematical evaluation model; nondestructive opto-electrical analysis; photo-acoustic spectra; photo-acoustic spectroscopy; powder material; reflection spectra; semiconductor device; silicon powder; single-layer model; sol-gel procedure; thin film; Absorption; Compounds; Photonic band gap; Powders; Silicon; Substrates; Titanium; Band gap; PAS; UV/Vis/NIR; silicon; silicon oxide; spectroscopy; titanium oxide;
fLanguage
English
Journal_Title
Semiconductor Manufacturing, IEEE Transactions on
Publisher
ieee
ISSN
0894-6507
Type
jour
DOI
10.1109/TSM.2012.2225647
Filename
6336833
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