• DocumentCode
    60453
  • Title

    Analyzing UV/Vis/NIR and Photo-Acoustic Spectra: A Note to the Band Gap of {\\rm Ti}_{\\rm x}{\\rm Si}_{1-{\\rm x}}{\\rm O}_{2}

  • Author

    Stadler, Alexander

  • Author_Institution
    Univ. of Salzburg, Salzburg, Austria
  • Volume
    26
  • Issue
    1
  • fYear
    2013
  • fDate
    Feb. 2013
  • Firstpage
    156
  • Lastpage
    161
  • Abstract
    Exact contact-free and non-destructive opto-electrical analysis of thin film and powder materials are necessary for efficient development and improvement of semiconductor devices. Besides the quality of the apparatus, the grade of the mathematical evaluation models is of importance for correct data acquisition. For UV/Vis/NIR spectroscopy, the single-layer model and the double-layer model, taking into account transmission and reflection spectra (with an integrating sphere), have shown excellent results, compared with other measurement techniques. A further comparatively unknown and contact-free optical analysis method is the photo-acoustic spectroscopy (PAS). In the following, it will be shown that both analyzing methods provide comparable band gap energies, using just the spectra or the well-known Tauc plot, respectively, an adequate novel plot for the PAS method. For verification, the band gap energy, Eg, of a silicon powder has been investigated. Then, direct and indirect Egs of special TixSi1-xO2 compounds, x=10%,..., 50% -prepared with a sophisticated sol-gel procedure-have been analyzed. The results point out that titanium is bound mainly in TiO2 (rutil), with increasing amounts of brookite and anatase in the case of rising x-values. For Ti contents below 10%, the powder tends, reasonably, to behave like a glass substrate.
  • Keywords
    glass; infrared spectroscopy; optoelectronic devices; photoacoustic spectra; photonic band gap; powders; reflectivity; semiconductor thin films; silicon compounds; sol-gel processing; titanium compounds; ultraviolet spectroscopy; PAS method; Tauc plot; TixSi1-xO2; UV/Vis/NIR spectroscopy; apparatus quality; band gap energy; contact-free opto-electrical analysis; double-layer model; glass substrate; mathematical evaluation model; nondestructive opto-electrical analysis; photo-acoustic spectra; photo-acoustic spectroscopy; powder material; reflection spectra; semiconductor device; silicon powder; single-layer model; sol-gel procedure; thin film; Absorption; Compounds; Photonic band gap; Powders; Silicon; Substrates; Titanium; Band gap; PAS; UV/Vis/NIR; silicon; silicon oxide; spectroscopy; titanium oxide;
  • fLanguage
    English
  • Journal_Title
    Semiconductor Manufacturing, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0894-6507
  • Type

    jour

  • DOI
    10.1109/TSM.2012.2225647
  • Filename
    6336833