• DocumentCode
    604867
  • Title

    Preliminary first principle based electro-thermal coupled solver for silicon carbide power devices

  • Author

    Fan, Angie ; Troszak, G. ; Desai, T. ; Palacios, T. ; Kaviany, M. ; Seungha Shin

  • Author_Institution
    Adv. Cooling Technol., Inc., Lancaster, PA, USA
  • fYear
    2013
  • fDate
    17-21 March 2013
  • Firstpage
    189
  • Lastpage
    193
  • Abstract
    The electrical behavior of high power, high frequency power devices is dramatically affected by heat generation caused due to interactions between energetic electrons and the lattice. It is critical that these interactions are taken into account when attempting to predict the electrical behavior of these devices. Since the hydrodynamic model follows the mass, momentum and energy transfer between the electrons/holes and phonons, it is capable of simultaneously predicting the electrical and thermal performance of these devices. This model is accurate and computationally efficient when properly correlated material parameters are available. In this work, a preliminary hydrodynamic transport device solver capable of accurately predicting the thermal and electrical performance of SiC devices is presented.
  • Keywords
    hydrodynamics; power semiconductor devices; semiconductor device models; silicon compounds; wide band gap semiconductors; SiC; electrical behavior; electrical performance; electro-thermal coupled solver; energetic electrons; energy transfer; heat generation; high power high frequency power devices; hydrodynamic model; hydrodynamic transport device solver; material parameters; thermal performance; Acoustics; Charge carrier processes; Hydrodynamics; Logic gates; Mathematical model; Phonons; Silicon carbide; SiC power switching devices; hydrodynamic approach; transient temperature solver;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM), 2013 29th Annual IEEE
  • Conference_Location
    San Jose, CA
  • ISSN
    1065-2221
  • Print_ISBN
    978-1-4673-6427-0
  • Electronic_ISBN
    1065-2221
  • Type

    conf

  • DOI
    10.1109/SEMI-THERM.2013.6526827
  • Filename
    6526827