The crucial influence of thermal interface material in power electronic design

Author

Schulz, Markus ; Allen, Scott T. ; Pohl, W.

Author_Institution

Infineon Technol., Neubiberg, Germany

fYear

2013

fDate

17-21 March 2013

Firstpage

251

Lastpage

254

Abstract

Thermal interface material (TIM) is a key component in the majority of power electronic systems. Heat, generated by the semiconductors, has to be transferred to a heat sink and finally dissipated to ambient. The solutions available today focus on applications like computer processors, mobile applications and discrete electronic devices. Though similar local power densities need to be handled, power electronics for industrial inverter applications based on power modules have different needs. The present paper deals with these needs and describes the steps in developing a thermal interface material, especially dedicated for the use in power electronics.

Keywords

heat sinks; invertors; power electronics; thermal management (packaging); TIM; computer processor; discrete electronic device; heat generation; heat sink; industrial inverter application; local power density; mobile application; power electronic design; power electronic system; power module; semiconductor; thermal interface material; Materials; Multichip modules; Power electronics; Temperature measurement; Thermal resistance; Thermal stability;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM), 2013 29th Annual IEEE

Conference_Location

San Jose, CA

ISSN

1065-2221

Print_ISBN

978-1-4673-6427-0

Electronic_ISBN

1065-2221

Type

conf

DOI

10.1109/SEMI-THERM.2013.6526839

Filename

6526839