Integrated matrix converter switch

This paper presents the design, assembly, functional test and preliminary technology assessment of highly integrated power switches for matrix converter application. The design is based on a built-in reliability approach and is verified experimentally by both functional and reliability tests. The assembly is based on a fully bond-wire-less double-sided cooling packaging solution, also featuring device stacking. As compared with standard solutions, the proposed integration approach brings along significant advancements in power density, as well as improvements in electro-magnetic and electro-thermal performance, by relying on a fully bond-wire-less double-sided cooled packaging concept.