Title :
Thermal-mechanical design of sandwich SiC power module with micro-channel cooling
Author :
Shan Yin ; Tseng, King-Jet ; Jiyun Zhao
Author_Institution :
Sch. of Electr. & Electron. Eng., Nanyang Technol. Univ., Singapore, Singapore
Abstract :
A sandwich packaging structure of SiC power module for HEV application has been designed and numerically investigated by CFD study. The design has a micro-channel heat sink integrated in the back Cu-layer of DBC substrate. Doubleside cooling is adopted and liquid coolant (ethylene glycol, 105 °C) flows in opposite directions in the two heat sinks. Compared with wirebonding packaging, the proposed sandwich structure can almost double the cooling efficiency (thermal resistance 0.11 K/W) and temperature-distribution uniformity. Finite element analysis of thermal stress was further carried out to check that the CTE mismatch in the packaging has been minimized.
Keywords :
computational fluid dynamics; coolants; cooling; finite element analysis; heat sinks; hybrid electric vehicles; modules; sandwich structures; silicon compounds; temperature distribution; thermal stresses; wide band gap semiconductors; CFD; CTE; DBC substrate; HEV application; SiC; back Cu-layer; double side cooling; finite element analysis; liquid coolant; microchannel cooling; microchannel heat sink; sandwich SiC power module; sandwich packaging structure; thermal stress; thermal-mechanical design; uniform temperature distribution; Electronic packaging thermal management; MOSFET; Packaging; Silicon carbide; Stress; Thermal resistance;
Conference_Titel :
Power Electronics and Drive Systems (PEDS), 2013 IEEE 10th International Conference on
Conference_Location :
Kitakyushu
Print_ISBN :
978-1-4673-1790-0
Electronic_ISBN :
2164-5256
DOI :
10.1109/PEDS.2013.6527077
