DocumentCode :
605303
Title :
Microcontact printing using flexible flat PDMS stamps with metal embedment
Author :
Ikjoo Byun ; Jongho Park ; Beomjoon Kim
Author_Institution :
CIRMM, Univ. of Tokyo, Tokyo, Japan
fYear :
2012
fDate :
16-19 Oct. 2012
Firstpage :
30
Lastpage :
33
Abstract :
This paper reports a microcontact printing (μCP) using flexible flat polydimethylsiloxane (PDMS) stamps with metal embedment. In conventional μCP process, self-assembled monolayer (SAM) ink can be transferred by conformal contact between a structural PDMS stamp and a substrate. In our research we utilized that hexadecanethiol (HDT), one of SAM ink molecules for μCP, can be soaked to the PDMS, but not to the Cr layer. Based on this fact, the PDMS with Cr embedment was used as a stamp for μCP even though there is `no structural tip´ (i.e. flat) in PDMS stamps. The new stamps for μCP have no mechanical deformation of stamps´ tip which is crucial problem of conventional PDMS stamps during μCP. Moreover, there are several advantages compared to other flat PDMS stamps, such as no limitation of lifetime and no contamination problem during fabrication process.
Keywords :
contamination; polymer blends; self-assembly; soft lithography; HDT; SAM ink molecules; conformal contact; contamination problem; conventional μCP process; conventional PDMS stamps; fabrication process; flexible flat PDMS stamps; flexible flat polydimethylsiloxane stamps; hexadecanethiol; mechanical deformation; metal embedment; microcontact printing; self-assembled monolayer ink; structural PDMS stamp; Dry lift-off process; Microcontact printing (μCP); Self-assembled monolayer (SAM); Surface modification;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Nanotechnology Materials and Devices Conference (NMDC), 2012 IEEE
Conference_Location :
Waikiki Beach, HI
Print_ISBN :
978-1-4673-2871-5
Type :
conf
DOI :
10.1109/NMDC.2012.6527585
Filename :
6527585
Link To Document :
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