Title :
Energy efficient and hign bandwidth embedded memory implementation
Author :
Mohammad, Baker ; Saleh, Hani
Author_Institution :
Electr. & Comput. Eng. Dept., Khalifa Univ. of Sci., Abu Dhabi, United Arab Emirates
Abstract :
Embedded memory is an important part of processors and system on Chip main matrix (performance, power and area). As a result, the ever increasing integration of embedded memory continues. SRAM cell is the preferred option for embedded memory because of low power density, smaller area, layout regularity, and high performance. Implementation options and organization of such memory have big impact on the power, area, and performance. The goal of this paper is to analyze the different options available for SRAM to enable energy efficient implementation including low voltage operation. The paper will present the findings of implementing high bandwidth (256-bit) L1 cache using SRAM cell with full swing bitline using 28nm foundry process technology. The result shows the design with full swing is more power efficient (10% less array power) than small swing sense amplifier based scheme. The area for the two design are compatible with 4-5% more area overhead for full swing. The proposed design support wordline overdrive assist circuit during write access to enable low voltage operation.
Keywords :
SRAM chips; cache storage; embedded systems; logic design; low-power electronics; microprocessor chips; system-on-chip; L1 cache; SRAM cell; energy efficient memory implementation; full swing bitline; high bandwidth embedded memory implementation; layout regularity; low power density; low voltage operation; process technology; processors; sense amplifier based scheme; size 28 nm; system on chip; word length 256 bit; wordline overdrive assist circuit; write access; Layout; Memory management; Random access memory; SRAM; embedded memory; low power design;
Conference_Titel :
Design & Technology of Integrated Systems in Nanoscale Era (DTIS), 2013 8th International Conference on
Conference_Location :
Abu Dhabi
Print_ISBN :
978-1-4673-6039-5
Electronic_ISBN :
978-1-4673-6038-8
DOI :
10.1109/DTIS.2013.6527790