• DocumentCode
    606829
  • Title

    Temperature effect on tribological and mechanical properties of MEMS

  • Author

    Pustan, M. ; Birleanu, C. ; Dudescu, C. ; Belcin, O.

  • Author_Institution
    Tech. Univ. of Cluj-Napoca, Cluj-Napoca, Romania
  • fYear
    2013
  • fDate
    14-17 April 2013
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    The scope of this paper is to analyze the temperature effect on tribological and mechanical properties of materials used in the fabrication of the flexible components from Microelectromechanical Systems (MEMS). Using a temperature control system and an atomic force microscope (AFM) with a nanoindentation module, the changes of the mechanical and tribological properties of MEMS material as a function of temperature are investigated. The temperature has influence on the tribological and mechanical behaviors of materials based on thermal relaxation. Firstly, the temperature effect on hardness and contact stiffness of MEMS materials is investigated. The coupling of the strain field to a temperature field provides an energy dissipation mechanism that allows the material to relax. In the case of investigated MEMS materials, the relaxation strength to be considered is that of the modulus of elasticity with influence on contact stiffness and hardness. Secondly, the temperature influence on tribological properties is determined. The tribological investigation of interest is the friction force measurement as a function of temperature. The direct measurement of the temperature effect on tribological and mechanical behavior of MEMS materials is important in order to improve the reliability design of MEMS and to increase the lifetime of microstructures from MEMS applications.
  • Keywords
    atomic force microscopy; design; elastic moduli; force measurement; friction; hardness; mechanical strength; micromechanical devices; nanoindentation; reliability; temperature control; AFM; MEMS; atomic force microscope; contact stiffness; energy dissipation mechanism; flexible component fabrication; friction force measurement; hardness; mechanical property; microelectromechanical system; modulus of elasticity; nanoindentation module; relaxation strength; reliability design; strain field; temperature control system; temperature effect; temperature field; thermal relaxation; tribological property; Abstracts; Aluminum; Atomic measurements; Force; Micromechanical devices; Reliability; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2013 14th International Conference on
  • Conference_Location
    Wroclaw
  • Print_ISBN
    978-1-4673-6138-5
  • Type

    conf

  • DOI
    10.1109/EuroSimE.2013.6529890
  • Filename
    6529890