Characterization of a new designed octahedron slotted metal track by simulations

Author

Kludt, J. ; Weide-Zaage, K. ; Ackermann, Mathieu ; Hein, V.

Author_Institution

Inf. Technol. Lab., Leibniz Univ. Hannover, Hannover, Germany

fYear

2013

fDate

14-17 April 2013

Firstpage

1

Lastpage

5

Abstract

Highly robust metallizations in ICs for high temperature and high current applications are needed. Special thick metal layers often known as “power metals” are added to achieve a higher current capability. But these metallizations suffer from reliability limitations as well. Therefore a new design for “power metals” was created for a 0.35μm aluminium CMOS process. The reliability of a new power metal structure is investigated in this article. A determination of the thermal-electrical and thermo-mechanical behaviour is carried out by simulations.

Keywords

CMOS integrated circuits; aluminium; integrated circuit design; integrated circuit metallisation; integrated circuit reliability; IC; aluminium CMOS process; current capability; high-temperature high-current applications; highly-robust metallizations; octahedron slotted metal track characterization; power metal structure reliability; power metals; reliability limitations; size 0.35 mum; thermal-electrical behaviour; thermo-mechanical behaviour; Abstracts; Artificial intelligence; RNA; Silicon; Tin;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2013 14th International Conference on

Conference_Location

Wroclaw

Print_ISBN

978-1-4673-6138-5

Type

conf

DOI

10.1109/EuroSimE.2013.6529907

Filename

6529907