Influence of wirebond shape on its lifetime with application to frame connections

Author

Czerny, B. ; Paul, I. ; Khatibi, G. ; Thoben, M.

Author_Institution

Fac. of Phys., Univ. of Vienna, Vienna, Austria

fYear

2013

fDate

14-17 April 2013

Firstpage

1

Lastpage

5

Abstract

The subject of this study was to investigate the effect of different geometrical loop shapes on the reliability of 400 μm thick Al bond wires in IGBT modules by means of experimental and analytical methods. The experimental fatigue tests have been realized by linear cyclic displacements of 5-45 μm of the contact plates at 200 Hz and 20 kHz. Life time curves were obtained for bond wire connections with different loop heights, distances and angles with the main failure mechanism being wire bond heel cracking. Furthermore an analytical model was developed to calculate the effect of variation of geometrical shape parameters on the stress at different locations of the bond wire. This model can be used to make a preliminary geometry selection of the bond wire and to predict the force or stress at critical sites of the wire bond during stress tests. This model was validated with finite element analysis.

Keywords

fatigue testing; finite element analysis; insulated gate bipolar transistors; reliability; wires (electric); IGBT modules; bond wire connection; bond wires; contact plates; different geometrical loop shapes; failure mechanism; fatigue test; finite element analysis; frame connection; geometrical shape parameter; geometry selection; linear cyclic displacement; reliability; wire bond heel cracking; wirebond shape; Abstracts; Bonding; Silicon; Stress; Wires;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2013 14th International Conference on

Conference_Location

Wroclaw

Print_ISBN

978-1-4673-6138-5

Type

conf

DOI

10.1109/EuroSimE.2013.6529909

Filename

6529909