DocumentCode
606850
Title
Accelerated lifetime test for isolated components in linear drivers of high-voltage LED system
Author
Bo Sun ; Sau Wee Koh ; Yuan, Chen ; Xuejun Fan ; Guoqi Zhang
Author_Institution
Beijing Res. Center, Delft Univ. of Technol., Beijing, China
fYear
2013
fDate
14-17 April 2013
Firstpage
1
Lastpage
5
Abstract
This paper proposes an isolated component accelerated lifetime testing of high-voltage SSL driver. In this method, the most critical component(s) will be isolated from the rest, and critical stress will be applied to these components to estimate the lifetime. Although circuit modification is unavoidable, this testing method can minimize failure interactions between components and testing duration for the system. Thus, compared to the conventional accelerated testing method, this method could achieve shorter test duration. In the configuration of high-voltage LED, the electrolytic capacitors have been selected from the linear driver configuration. As one of most significant failure mechanisms, the effects of high temperature degradation of electrolytic capacitors to the entire system were investigated in this test. To quantify these effects, the changes in luminous flux and power consumption over time were measured. By analysis of all these output data, the relationship between the system´s outputs and temperature of electrolytic capacitor can be found. For the high-voltage LED system, this relationship is a required condition for the accurate system reliability prediction.
Keywords
circuit reliability; driver circuits; electrolytic capacitors; life testing; light emitting diodes; accelerated lifetime test; electrolytic capacitor; failure mechanism; high voltage LED system; isolated components; linear driver configuration; system reliability prediction; Abstracts; Capacitors; Heating; Light emitting diodes; Lighting; Maintenance engineering; Reliability; Accelerated lifetime test; Solid State Lighting; electrolytic capacitor; high-voltage LED; linear driver;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2013 14th International Conference on
Conference_Location
Wroclaw
Print_ISBN
978-1-4673-6138-5
Type
conf
DOI
10.1109/EuroSimE.2013.6529911
Filename
6529911
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