Title :
Multi-physics simulation of the component attachment within embedding process
Author :
Macurova, K. ; Kharicha, A. ; Pletz, M. ; Mataln, M. ; Bermejo, R. ; Schongrundner, R. ; Krivec, T. ; Antretter, Thomas ; Maia, W. ; Morianz, M. ; Brizoux, M.
Author_Institution :
Mater. Center Leoben Forschung GmbH, Leoben, Austria
Abstract :
With the trend towards increasing complexity of Printed Circuit Boards (PCB), there has been considerable interest of investigation of the embedding process. The main focus has been set on the first step, the chip attachment by using an adhesive. Investigation of the adhesive thickness underneath the component by a numerical and an analytical model has been provided. The numerical model was produced with commercial program Ansys FLUENT. The results of both models are compared with experimental data to validate the models.
Keywords :
adhesives; circuit complexity; formal verification; printed circuits; PCB complexity; adhesive thickness; commercial program Ansys FLUENT; component attachment; embedding process; model validation; multiphysics simulation; numerical model; printed circuit boards complexity; Abstracts; Analytical models; Copper; Differential equations; Numerical models; Reliability;
Conference_Titel :
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2013 14th International Conference on
Conference_Location :
Wroclaw
Print_ISBN :
978-1-4673-6138-5
DOI :
10.1109/EuroSimE.2013.6529914
