Multi-physics simulation of the component attachment within embedding process

Author

Macurova, K. ; Kharicha, A. ; Pletz, M. ; Mataln, M. ; Bermejo, R. ; Schongrundner, R. ; Krivec, T. ; Antretter, Thomas ; Maia, W. ; Morianz, M. ; Brizoux, M.

Author_Institution

Mater. Center Leoben Forschung GmbH, Leoben, Austria

fYear

2013

fDate

14-17 April 2013

Firstpage

1

Lastpage

6

Abstract

With the trend towards increasing complexity of Printed Circuit Boards (PCB), there has been considerable interest of investigation of the embedding process. The main focus has been set on the first step, the chip attachment by using an adhesive. Investigation of the adhesive thickness underneath the component by a numerical and an analytical model has been provided. The numerical model was produced with commercial program Ansys FLUENT. The results of both models are compared with experimental data to validate the models.

Keywords

adhesives; circuit complexity; formal verification; printed circuits; PCB complexity; adhesive thickness; commercial program Ansys FLUENT; component attachment; embedding process; model validation; multiphysics simulation; numerical model; printed circuit boards complexity; Abstracts; Analytical models; Copper; Differential equations; Numerical models; Reliability;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2013 14th International Conference on

Conference_Location

Wroclaw

Print_ISBN

978-1-4673-6138-5

Type

conf

DOI

10.1109/EuroSimE.2013.6529914

Filename

6529914