DocumentCode
606928
Title
Numerical modeling of the electroplating process for microvia fabrication
Author
Strusevich, N. ; Bailey, Christopher ; Costello, S. ; Patel, Mitesh ; Desmulliez, M.
Author_Institution
Sch. of Comput. & Math. Sci., Univ. of Greenwich, London, UK
fYear
2013
fDate
14-17 April 2013
Firstpage
1
Lastpage
6
Abstract
For numerical simulation of electrodeposition in small features, we have developed a novel method that allows an explicit tracking of the interface between the electrolyte and the deposited metal. The method is implemented in the CFD package PHYSICA and validated by comparing the delivered simulation results with those achieved by real-life measurements and/or obtained by another piece of software, COMSOL Multiphysics using a standard electrodeposition module.
Keywords
computational fluid dynamics; electrolytes; electroplating; numerical analysis; CFD package; COMSOL multiphysics; PHYSICA; electrodeposition module; electrolyte; electroplating process; explicit tracking; microvia fabrication; numerical modeling; software; Abstracts; Copper; Filling; Physics;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2013 14th International Conference on
Conference_Location
Wroclaw
Print_ISBN
978-1-4673-6138-5
Type
conf
DOI
10.1109/EuroSimE.2013.6529989
Filename
6529989
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