DocumentCode
607107
Title
miniLABs drop in and become fascinated by engineering experiments
Author
Pleul, C. ; Hermes, M. ; Chatti, S. ; Tekkaya, A. Erman
Author_Institution
Inst. of Forming Technol. & Lightweight Constr. (IUL), Tech. Univ. Dortmund, Dortmund, Germany
fYear
2013
fDate
13-15 March 2013
Firstpage
687
Lastpage
691
Abstract
Laboratory experiments play a significant role in engineering education. The main concern of the described hands-on miniLABs initiative (as a work in progress) is lowering the hurdles in order to provide engineering students with an informal and straightforward access to experiments carried out in labs of the IUL at TU Dortmund University. miniLABs will offer students different, short and voluntary hands-on lab sessions, consisting of two different modes and different aspects related to manufacturing technology in the field of forming processes. In small teams, students can get in touch with practical engineering activities in the fields of present scientific research, either to study a certain phenomenon or to look at a wider engineering context. Based on the framework of experiential learning, miniLABs tries to foster the shift from teaching to deep learning. Finally, this initiative aims to inspire young students for real and hands-on engineering experiments and to contribute to the science education of these young and future engineers.
Keywords
educational institutions; engineering education; forming processes; industrial engineering; laboratories; student experiments; Dortmund University; IUL; engineering education; forming processes; hands-on engineering experiments; hands-on lab sessions; laboratory experiments; manufacturing technology; miniLABs; practical engineering activities; scientific research; teaching; Context; Educational institutions; Engineering education; Laboratories; Manufacturing; Materials; engineering education; experiments; forming; laboratory learning; manufacturing technology;
fLanguage
English
Publisher
ieee
Conference_Titel
Global Engineering Education Conference (EDUCON), 2013 IEEE
Conference_Location
Berlin
ISSN
2165-9559
Print_ISBN
978-1-4673-6111-8
Electronic_ISBN
2165-9559
Type
conf
DOI
10.1109/EduCon.2013.6530181
Filename
6530181
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