• DocumentCode
    60736
  • Title

    Low-Cost PCB-Integrated 10-Gb/s Optical Transceiver Built With a Novel Integration Method

  • Author

    Bamiedakis, N. ; Hashim, Aniqah ; Beals, J. ; Penty, Richard V. ; White, Ian H.

  • Author_Institution
    Eng. Dept., Univ. of Cambridge, Cambridge, UK
  • Volume
    3
  • Issue
    4
  • fYear
    2013
  • fDate
    Apr-13
  • Firstpage
    592
  • Lastpage
    600
  • Abstract
    A novel integration method for the production of cost-effective optoelectronic printed circuit boards (OE PCBs) is presented. The proposed integration method allows fabrication of OE PCBs with manufacturing processes common to the electronics industry while enabling direct attachment of electronic components onto the board with solder reflow processes as well as board assembly with automated pick-and-place tools. The OE PCB design is based on the use of polymer multimode waveguides, end-fired optical coupling schemes, and simple electro-optic connectors, eliminating the need for additional optical components in the optical layer, such as micro-mirrors and micro-lenses. A proof-of-concept low-cost optical transceiver produced with the proposed integration method is presented. This transceiver is fabricated on a low-cost FR4 substrate, comprises a polymer Y-splitter together with the electronic circuitry of the transmitter and receiver modules and achieves error-free 10-Gb/s bidirectional data transmission. Theoretical studies on the optical coupling efficiencies and alignment tolerances achieved with the employed end-fired coupling schemes are presented while experimental results on the optical transmission characteristics, frequency response, and data transmission performance of the integrated optical links are reported. The demonstrated optoelectronic unit can be used as a front-end optical network unit in short-reach datacommunication links.
  • Keywords
    coupled circuits; integrated optoelectronics; optical transceivers; optical waveguides; printed circuit design; printed circuit manufacture; solders; OE PCB design; OE PCB fabrication; alignment tolerances; automated pick-and-place tools; bit rate 10 Gbit/s; cost-effective OE PCB production; cost-effective optoelectronic printed circuit board production; electronic circuitry; electronic components; electronics industry; electrooptic connectors; employed end-fired coupling schemes; end-fired optical coupling schemes; error-free bidirectional data transmission; frequency response; front-end optical network unit; integrated optical links; integration method; low-cost FR4 substrate; low-cost PCB-integrated optical transceiver; microlenses; micromirrors; optical components; optical coupling efficiencies; optical layer; optical transmission characteristics; polymer V-splitter; polymer multimode waveguides; proof-of-concept low-cost optical transceiver; receiver modules; short-reach data communication links; solder reflow processes; transmitter modules; Connectors; Couplings; High speed optical techniques; Optical coupling; Optical device fabrication; Optical receivers; Optical waveguides; Integrated optoelectronics; optical interconnections; optical waveguides; photonic integrated circuits;
  • fLanguage
    English
  • Journal_Title
    Components, Packaging and Manufacturing Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    2156-3950
  • Type

    jour

  • DOI
    10.1109/TCPMT.2013.2242961
  • Filename
    6464527