• DocumentCode
    608177
  • Title

    Design for reliability through engineering optimization

  • Author

    Wee Loon Ng ; Yong Chiang Ee ; Kin Leong Pey ; Chuan Seng Tan

  • Author_Institution
    GLOBALFOUNDRIES Singapore Pte Ltd., Singapore, Singapore
  • fYear
    2013
  • fDate
    14-18 April 2013
  • Abstract
    With complex process integration approaches and severe fabrication limitations caused by the introduction of new materials and diminishing process margins, there are mounting concerns over possible increased failure rate [1] at the early life cycle (e.g. <;1 year operation) of product use, known as infant mortality failures. A paradigm change in reliability qualification methodology, to aim at understanding the impact of variations on reliability [2-3], is required to ensure that reliability robustness is integrated into the design of the technology to prevent problems from surfacing during product qualification and application. By applying the improved variation control though process Design-For-Reliability (DFR) and engineering optimization methodology as described in Figure 2 and Figure 3, this work aims to establish an effective and efficient method to reduce the infant mortality failure rate of the product, through understanding critical design and process factors and determining the optimal design and process conditions to ensure reliability robustness.
  • Keywords
    failure analysis; optimisation; reliability; semiconductor industry; DFR process; complex process integration approaches; design-for-reliability process; diminishing process margins; engineering optimization; engineering optimization methodology; failure rate; improved variation control; mortality failures; process factors; product qualification; reliability design; reliability qualification methodology; reliability robustness; Metals; Qualifications; Reliability engineering; Robustness; Semiconductor device reliability; Transistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium (IRPS), 2013 IEEE International
  • Conference_Location
    Anaheim, CA
  • ISSN
    1541-7026
  • Print_ISBN
    978-1-4799-0112-8
  • Electronic_ISBN
    1541-7026
  • Type

    conf

  • DOI
    10.1109/IRPS.2013.6531996
  • Filename
    6531996