DocumentCode
608238
Title
Trap spectroscopy and Ta penetration induced charge trapping in porous SiOCH low-k dielectrics
Author
Yunlong Li ; Chen Wu ; Degraeve, Robin ; Croes, Kristof ; Barbarin, Y. ; Baklanov, M.R. ; Tokei, Z.
Author_Institution
Imec, Leuven, Belgium
fYear
2013
fDate
14-18 April 2013
Abstract
The method “trap spectroscopy by charge injection and sensing” (TSCIS) is applied to porous SiOCH low-k dielectrics integrated in MIS capacitors with Ta based diffusion barriers. Most of the low-k samples show an unexpected negative flatband voltage shift with charge injection, which we attribute to positive charge built up in the bulk low-k due to Ta penetration. The only porous low-k sample that can be fitted using the standard TSCIS method is a k=2.0 material in combination with a low pore penetration barrier. The fitted trap distribution demonstrates a low trap density and an amorphous structure. It is also shown that UV treatment can change the low-k charge trapping behavior.
Keywords
MIS capacitors; charge injection; copper; dielectric materials; electric sensing devices; porous materials; tantalum; tantalum compounds; ultraviolet spectra; Cu; MIS capacitor; Si; Ta based diffusion barrier; Ta penetration; TaN-Ta; UV treatment; amorphous structure; fitted trap distribution; low pore penetration barrier; low trap density; low-k charge trapping behavior; porous SiOCH low-k dielectrics integration; positive charge; standard TSCIS method; trap spectroscopy by charge injection and sensing; unexpected negative flatband voltage shift; Charge carrier processes; Dielectrics; Films; Spectroscopy; Stress; Temperature measurement; SiOCH low-k; TSCIS; charge trapping; diffusion barrier; pore penetration; trap distribution; trap spectroscopy;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium (IRPS), 2013 IEEE International
Conference_Location
Anaheim, CA
ISSN
1541-7026
Print_ISBN
978-1-4799-0112-8
Electronic_ISBN
1541-7026
Type
conf
DOI
10.1109/IRPS.2013.6532057
Filename
6532057
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