• DocumentCode
    608239
  • Title

    Similarities of lags, current collapse and breakdown characteristics between source and gate field-plate AlGaN/GaN HEMTs

  • Author

    Hanawa, H. ; Onodera, Hidetoshi ; Nakajima, Akitoshi ; Horio, K.

  • Author_Institution
    Fac. of Syst. Eng., Shibaura Inst. of Technol., Saitama, Japan
  • fYear
    2013
  • fDate
    14-18 April 2013
  • Abstract
    Two-dimensional analysis of lag phenomena, current collapse and breakdown voltages in source-field-plate AlGaN/GaN HEMTs is performed by considering a deep donor and a deep acceptor in a buffer layer, and the results are compared with those for the case of gate-field-plate structure. It is shown that the reduction rate of drain-lag is similar between the two structures, but the reduction rates of gate lag and current collapse are smaller for the source-field-plate structure. This is because the electric field at the drain edge of the gate becomes higher in the off state and the trapping effects become more significant. For this reason, an off-state breakdown voltage is a little lower in the source-field-plate structure. It is suggested that there is an optimum thickness of SiN passivation layer to minimize the buffer-related current collapse in both structures.
  • Keywords
    III-V semiconductors; aluminium compounds; gallium compounds; high electron mobility transistors; passivation; semiconductor device breakdown; silicon compounds; wide band gap semiconductors; AlGaN-GaN; breakdown characteristics; buffer layer; buffer-related current collapse; deep acceptor; deep donor; drain-lag reduction rate; electric field; gate drain edge; gate field-plate HEMT; gate-field-plate structure; lag phenomena; off-state breakdown voltage; optimum thickness; passivation layer; source field-plate HEMT; trapping effects; two-dimensional analysis; Aluminum gallium nitride; Buffer layers; Gallium nitride; HEMTs; Logic gates; MODFETs; Transient analysis; GaN; HEMT; breakdown voltage; current collapse; field plate; lag phenomena; two-dimensional analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium (IRPS), 2013 IEEE International
  • Conference_Location
    Anaheim, CA
  • ISSN
    1541-7026
  • Print_ISBN
    978-1-4799-0112-8
  • Electronic_ISBN
    1541-7026
  • Type

    conf

  • DOI
    10.1109/IRPS.2013.6532058
  • Filename
    6532058