Title :
Logarithmic modeling of BTI under dynamic circuit operation: Static, dynamic and long-term prediction
Author :
Velamala, J.B. ; Sutaria, Ketul B. ; Shimuzu, H. ; Awano, Hiromitsu ; Sato, Takao ; Wirth, Glen ; Yu Cao
Author_Institution :
Sch. of ECEE, Arizona State Univ., Tempe, AZ, USA
Abstract :
Bias temperature instability (BTI) is the dominant source of aging in nanoscale transistors. Recent works show the role of charge trapping/de-trapping (T-D) in BTI through discrete Vth shifts, with the degradation exhibiting an excessive amount of randomness. Furthermore, modern circuits employ dynamic voltage scaling (DVS) where Vdd is tuned, complicating the aging effect. It becomes challenging to predict long-term aging in an actual circuit under statistical variation and DVS. To accurately predict the degradation in these circumstances, this work (1) examines the principles of T-D, thereby proposing static and cycle-to-cycle (dynamic) models under voltage tuning in DVS; (2) presents a long-term model, estimating a tight upper bound of dynamic aging; (3) comprehensively validates the new set of models with 65nm silicon data. The proposed aging models accurately capture the recovery behavior in dynamic operations, reducing the unnecessary margin and enhancing the simulation efficiency for aging estimation during the design stage.
Keywords :
ageing; elemental semiconductors; semiconductor device models; semiconductor device reliability; silicon; statistical analysis; transistors; BTI; BTI logarithmic modeling; DVS; T-D principles; aging effect; aging estimation; aging model; bias temperature instability; charge trapping-detrapping; cycle-to-cycle model; design stage; discrete shifts; dynamic aging; dynamic circuit operation; dynamic prediction; dynamic voltage scaling; long-term aging; long-term prediction; nanoscale transistors; recovery behavior; silicon data; simulation efficiency; size 65 nm; static model; static prediction; statistical variation; voltage tuning; Aging; Charge carrier processes; Data models; Degradation; Integrated circuit modeling; Predictive models; Stress; DVS; Trapping/de-trapping; compact modeling; negative bias temperature instability; statistical variations;
Conference_Titel :
Reliability Physics Symposium (IRPS), 2013 IEEE International
Conference_Location :
Anaheim, CA
Print_ISBN :
978-1-4799-0112-8
Electronic_ISBN :
1541-7026
DOI :
10.1109/IRPS.2013.6532063