DocumentCode
608244
Title
Logarithmic modeling of BTI under dynamic circuit operation: Static, dynamic and long-term prediction
Author
Velamala, J.B. ; Sutaria, Ketul B. ; Shimuzu, H. ; Awano, Hiromitsu ; Sato, Takao ; Wirth, Glen ; Yu Cao
Author_Institution
Sch. of ECEE, Arizona State Univ., Tempe, AZ, USA
fYear
2013
fDate
14-18 April 2013
Abstract
Bias temperature instability (BTI) is the dominant source of aging in nanoscale transistors. Recent works show the role of charge trapping/de-trapping (T-D) in BTI through discrete Vth shifts, with the degradation exhibiting an excessive amount of randomness. Furthermore, modern circuits employ dynamic voltage scaling (DVS) where Vdd is tuned, complicating the aging effect. It becomes challenging to predict long-term aging in an actual circuit under statistical variation and DVS. To accurately predict the degradation in these circumstances, this work (1) examines the principles of T-D, thereby proposing static and cycle-to-cycle (dynamic) models under voltage tuning in DVS; (2) presents a long-term model, estimating a tight upper bound of dynamic aging; (3) comprehensively validates the new set of models with 65nm silicon data. The proposed aging models accurately capture the recovery behavior in dynamic operations, reducing the unnecessary margin and enhancing the simulation efficiency for aging estimation during the design stage.
Keywords
ageing; elemental semiconductors; semiconductor device models; semiconductor device reliability; silicon; statistical analysis; transistors; BTI; BTI logarithmic modeling; DVS; T-D principles; aging effect; aging estimation; aging model; bias temperature instability; charge trapping-detrapping; cycle-to-cycle model; design stage; discrete shifts; dynamic aging; dynamic circuit operation; dynamic prediction; dynamic voltage scaling; long-term aging; long-term prediction; nanoscale transistors; recovery behavior; silicon data; simulation efficiency; size 65 nm; static model; static prediction; statistical variation; voltage tuning; Aging; Charge carrier processes; Data models; Degradation; Integrated circuit modeling; Predictive models; Stress; DVS; Trapping/de-trapping; compact modeling; negative bias temperature instability; statistical variations;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium (IRPS), 2013 IEEE International
Conference_Location
Anaheim, CA
ISSN
1541-7026
Print_ISBN
978-1-4799-0112-8
Electronic_ISBN
1541-7026
Type
conf
DOI
10.1109/IRPS.2013.6532063
Filename
6532063
Link To Document