DocumentCode
608634
Title
High density optical interconnects integrated with lasers, optical modulators and photodetectors on a single silicon chip
Author
Urino, Yutaka ; Horikawa, Tsuyoshi ; Nakamura, T. ; Arakawa, Yasuhiko
Author_Institution
Inst. for Photonics-Electron. Convergence Syst. Technol. (PECST), Japan
fYear
2013
fDate
17-21 March 2013
Firstpage
1
Lastpage
3
Abstract
Silicon optical interposers for inter-chip interconnects, integrated with lasers, an optical splitter, optical modulators and germanium photodetectors on a single silicon substrate were demonstrated. A 12.5-Gbps error-free data transmission and 6.6-Tbps/cm2 transmission density were achieved.
Keywords
optical interconnections; optical modulation; photodetectors; error free data transmission; germanium photodetectors; high density optical interconnects; interchip interconnects; lasers; optical modulators; optical splitter; silicon chip; silicon optical interposer; single silicon substrate; transmission density; Adaptive optics; Optical device fabrication; Optical interconnections; Optical modulation; Optical polarization; Optical waveguides; Silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
Optical Fiber Communication Conference and Exposition and the National Fiber Optic Engineers Conference (OFC/NFOEC), 2013
Conference_Location
Anaheim, CA
Print_ISBN
978-1-4799-0457-0
Type
conf
Filename
6532774
Link To Document