DocumentCode :
609652
Title :
Improving and optimizing reliability in future technologies with high-κ dielectrics
Author :
Linder, B.P. ; Cartier, E. ; Krishnan, Sridhar ; Wu, E.
Author_Institution :
IBM T. J. Watson Res. Center, Yorktown Heights, NY, USA
fYear :
2013
fDate :
22-24 April 2013
Firstpage :
1
Lastpage :
4
Abstract :
Three mechanisms primarily limit gate oxide scaling: bias temperature instability in both NFETs (PBTI) and PFETs (NBTI), and gate dielectric breakdown in NFETs (nTDDB). Strategies for reducing each mechanism are identified, and the overall effect of each mechanism on future scaling is discussed. Specialized ring oscillator structures that aid in the understanding of the effect of both PBTI and NBTI on circuit operation are explored.
Keywords :
electric breakdown; field effect transistors; high-k dielectric thin films; negative bias temperature instability; oscillators; semiconductor device reliability; NBTI; NFET; PBTI; PFET; gate dielectric breakdown; high-κ dielectrics; reliability optimization; specialized ring oscillator structures; Degradation; Dielectrics; Integrated circuit reliability; Logic gates; Stress; Transistors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
VLSI Design, Automation, and Test (VLSI-DAT), 2013 International Symposium on
Conference_Location :
Hsinchu
Print_ISBN :
978-1-4673-4435-7
Type :
conf
DOI :
10.1109/VLDI-DAT.2013.6533828
Filename :
6533828
Link To Document :
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