• DocumentCode
    609677
  • Title

    Aging-aware statistical soft-error-rate analysis for nano-scaled CMOS designs

  • Author

    Lin, C.Y.H. ; Huang, Ryan H.-M ; Wen, Charles H.-P ; Chang, Austin C.-C

  • Author_Institution
    Dept. Electr. & Comput. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
  • fYear
    2013
  • fDate
    22-24 April 2013
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Aging and soft errors have become the two most critical reliability issues for nano-scaled CMOS designs. In this paper, the aging effect due to negative bias temperature instability (NBTI) is first analyzed on cells using a 45nm CMOS technology for soft errors. Second, an accurate statistical soft-error-rate (SSER) framework is built and incorporates the aging-aware cell models. As a result, two findings are discovered: (1) PMOS-induced transient faults, comparing to NMOS-induced ones, have more variation in pulse widths since PMOS is more susceptible to NBTI; (2) NBTI together with process variation, induces more soft errors (~19%) and thus needs to be considered, simultaneously, during circuit analysis. Experimental result shows that our SSER framework considering both process variation and aging is efficient (with multiple-order speedups) and achieves high accuracy (with <;3% errors) when compared with Monte-Carlo SPICE simulation.
  • Keywords
    CMOS integrated circuits; Monte Carlo methods; integrated circuit reliability; nanoelectronics; radiation hardening (electronics); Monte-Carlo SPICE simulation; NBTI; NMOS-induced transient faults; PMOS-induced transient faults; SSER framework; aging-aware statistical soft-error-rate analysis; nanoscaled CMOS designs; negative bias temperature instability; size 45 nm; Aging; Circuit faults; Computational modeling; Error analysis; Integrated circuit modeling; MOS devices; Transient analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Design, Automation, and Test (VLSI-DAT), 2013 International Symposium on
  • Conference_Location
    Hsinchu
  • Print_ISBN
    978-1-4673-4435-7
  • Type

    conf

  • DOI
    10.1109/VLDI-DAT.2013.6533854
  • Filename
    6533854