TSV plating using copper methanesulfonate electrolyte with single component suppressor

This paper presents copper filling of TSV using an acidic cupric methanesulfonate electroplating electrolyte containing chloride and a poloxamine suppressor. The process was accomplished utilizing a single component suppressor system. Such a plating system might simplify the additive replenishment procedure during the TSV filling. The influence of the poloxamine on the copper deposition was also investigated. The poloxamine greatly inhibited the copper electrodeposition on a platinum rotating electrode and might function as an effective suppressor. Compared with the conventional suppressor PEG, poloxamine had a larger time constant and smaller diffusion constant.