DocumentCode
609832
Title
Analysis of thermo-mechanical stresses in novel back contact solar modules
Author
Wiese, Stefan ; Kraemer, F.
Author_Institution
Saarland University, Chair of Microintegration and Reliability, Campus A5 1, D-66123 Saarbruecken, Germany
fYear
2012
fDate
17-20 Sept. 2012
Firstpage
1
Lastpage
6
Abstract
The mechanical integrity of interconnect structures in photovoltaic modules is a crucial factor for the lifetime of a PV power plant. Therefore the mechanical stresses in different types of PV module assemblies were analyzed by FEM-simulations. The goal is to develop a systematic understanding of mechanical behavior of photovoltaic modules. The study figures out the critical elements in the module interconnect structures which are most likely to fail.
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic System-Integration Technology Conference (ESTC), 2012 4th
Conference_Location
Amsterdam, Netherlands
Print_ISBN
978-1-4673-4645-0
Type
conf
DOI
10.1109/ESTC.2012.6542206
Filename
6542206
Link To Document