• DocumentCode
    609832
  • Title

    Analysis of thermo-mechanical stresses in novel back contact solar modules

  • Author

    Wiese, Stefan ; Kraemer, F.

  • Author_Institution
    Saarland University, Chair of Microintegration and Reliability, Campus A5 1, D-66123 Saarbruecken, Germany
  • fYear
    2012
  • fDate
    17-20 Sept. 2012
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    The mechanical integrity of interconnect structures in photovoltaic modules is a crucial factor for the lifetime of a PV power plant. Therefore the mechanical stresses in different types of PV module assemblies were analyzed by FEM-simulations. The goal is to develop a systematic understanding of mechanical behavior of photovoltaic modules. The study figures out the critical elements in the module interconnect structures which are most likely to fail.
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic System-Integration Technology Conference (ESTC), 2012 4th
  • Conference_Location
    Amsterdam, Netherlands
  • Print_ISBN
    978-1-4673-4645-0
  • Type

    conf

  • DOI
    10.1109/ESTC.2012.6542206
  • Filename
    6542206