• DocumentCode
    609836
  • Title

    Thick film 3-D electrode configuration for electrochemical applications

  • Author

    Adamek, Martin ; Stekovic, Michal ; Szendiuch, Ivan

  • Author_Institution
    Department of Microelectronics, FEEC, BUT Technicka 10, 616 00 Brno, Czech Republic
  • fYear
    2012
  • fDate
    17-20 Sept. 2012
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    Miniature electrochemical sensors can be economically produced by thick-film technology. An area of working electrode and an electrode topology design is the important parts of design optimization of electrode system. The design of standard thick-film electrode construction is limited (2-D construction, substrate dimensions, resolution, paste parameters …). Therefore rules for classical electrode systems cannot be used fully in this case and larger electrode area can be making by 3-D structure only. One of resolutions is unconventional method. The increase of electrode surface by unconventional method — ball and wire bonding is discussed in this paper. The sensors with standard TFT gold surface of working electrode and increased surface of working electrode, e.q. by gold bonds and gold wires, was tested and compared. The practical measurement was made in a model reversible system, alkaline solution mixture of potassium ferricyanide and potassium ferrocyanide, and in solution with heavy metals. The first results show that the thick-film electrochemical sensors with standard gold surface of working electrode have lowest output current signal than sensors with new electrode configuration. The new designed sensor with modified surface by gold wires shows is one of the best results by all types of measured sensors.
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic System-Integration Technology Conference (ESTC), 2012 4th
  • Conference_Location
    Amsterdam, Netherlands
  • Print_ISBN
    978-1-4673-4645-0
  • Type

    conf

  • DOI
    10.1109/ESTC.2012.6542212
  • Filename
    6542212