DocumentCode
61026
Title
on-Resistance Degradation Induced by Hot-Carrier Injection in SOI SJ-LDMOS
Author
Chao Xia ; Xinhong Cheng ; Zhongjian Wang ; Duo Cao ; Tingting Jia ; Yuehui Yu ; Dashen Shen
Author_Institution
State Key Lab. of Functional Mater. for Inf., Shanghai Inst. of Microsyst. & Inf. Technol., Shanghai, China
Volume
60
Issue
3
fYear
2013
fDate
Mar-13
Firstpage
1279
Lastpage
1281
Abstract
In this brief, anomalous hot-carrier degradation phenomenon in n-type superjunction lateral DMOS transistors on a SOI substrate is investigated. An unexpected on-resistance (Ron) decrease was observed at the beginning of stress, but Ron increases with the stress time. The reason was analyzed with the 3-D simulation of electrical field and impact ionization generation. The injection of hot holes into the field oxide near the drain region leads to the Ron decrease during the early stress period. With the increase of stress time, trapped hot holes accumulated in the field oxide and act as electron defects to trap electrons, altogether with hot electrons trapped in gate oxide above the accumulation region, contributing to Ron increase.
Keywords
MOSFET; hot carriers; impact ionisation; silicon-on-insulator; 3D simulation; SOI SJ-LDMOS; SOI substrate; Si; accumulation region; anomalous hot-carrier degradation phenomenon; electrical field; electron defects; field oxide; hot electrons; hot hole injection; hot-carrier injection; impact ionization generation; n-type superjunction lateral DMOS transistors; on-resistance degradation; stress time; trapped hot holes; unexpected on-resistance decrease; Degradation; Electron traps; Hot carrier injection; Logic gates; Stress; Hot carrier; SOI; lateral DMOS (LDMOS); reliability; superjunction (SJ) LDMOS (SJ-LDMOS);
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/TED.2013.2242077
Filename
6464554
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